Bo Liu

Senior Director Engineering, China

Bo Liu joined Palma Ceia SemiDesign in 2021 as Director of Engineering in China. He has responsibility for all engineering activities in China and is directly involved in driving the success of customer and partner engagements. Before joining Palma Ceia, Bo served as Senior Director for wireless IC Design at Shanghai Artosyn Microelectronics. Previous experience includes engineering roles with Advanced Micro Devices, Huawei, Freescale and Alcatel. He was also Principal Engineer at worldwide ASIC design consultancy and semiconductor solution provider Sondrel, where his assignments included projects for Intel and Cisco. Bo holds BS and MS degrees in Electronic Engineering from Xidian University in Xi’an, China.